WaferProber: Difference between revisions
Line 19: | Line 19: | ||
== Device Class programming == | == Device Class programming == | ||
=== | === Module specific concepts === | ||
* the next sweep value is given by "<die>-<subsite>" where <die> is the next value for the die and <subsite> is the next value for the subsite. | * the next sweep value is given by "<die>-<subsite>" where <die> is the next value for the die and <subsite> is the next value for the subsite. |
Revision as of 22:14, 6 January 2020
A wafer prober is an instrument to automatically contact a silicon wafer with needles.
Concept
The module is designed to call a probe plan from an external software (e.g. Nucleus, Velox) or from a probe plan file, depending on the implementation of the device class. The user can then select dies or subsites to be used. The combination of all selected dies and selected subsites is measured (assuming the standard sweep values are used).
User interface
- The button "Get probe plan" is used to retrieve the probe plan.
- The button "Go to next die" can be used during the measurement to go to the die that would be the next in the sequence.
- The button "Go to next subsite" can be used during the measurement to go to the subsite that would be the next in the sequence.
- Use the selection box "Sweep value die" to choose which source is used to vary dies.
- Use the selection box "Sweep value subsite" to choose which source is used to vary subsite.
- Use the right-click menu of the die table or the current table to easily change the selection.
Sweep values
The standard sweep values are "Die table" and "Subsite table" which means that the selections within the tables at the bottom of the module are used. Further sweep values are "Current die" and "Current subsite" which means that either the die table or the subsite table is not used. Instead the wafer prober contacts the current die or current subsite.
Device Class programming
Module specific concepts
- the next sweep value is given by "<die>-<subsite>" where <die> is the next value for the die and <subsite> is the next value for the subsite.
- If the user selected "Current die" or "Current subsite" as sweep mode, the sweep value is replaced by a 'c', e.g. "<die>-c", "c-<subsite>", "c-c". It is the duty of the device class to make sure that the the current die or current subsite is used during apply
Module specific functions
There are function that are only called by the WaferProber module. We recommend to use the device class 'WaferProber-Cascade_Nucleus' as a template.
get_ProbePlan
use this function to return a list of dies and a list of subsites
get_CurrentDieIndex
use this function to return a string of the current die index that is used to refresh the user interface
get_CurrentSubsiteIndex
use this function to return a string of the current subsite index that is used to refresh the user interface
get_CurrentCoordinates
use this function to return the x and y coordinate as strings